SIGNING OF MEMORANDUM OF UNDERSTANDING ON
BRUNEI DARUSSALAM-SINGAPORE YOUTH EDUCATION SCHOLARSHIP
Wednesday, 24 August 2022 – The Government of His Majesty the Sultan and Yang Di-Pertuan of Brunei Darussalam and the Government of the Republic of Singapore, today signed a Memorandum of Understanding on the Brunei Darussalam – Singapore Youth Education Scholarship.
Signing on behalf of the Government of His Majesty the Sultan and Yang Di-Pertuan of Brunei Darussalam was The Honourable Datin Seri Setia Dr. Hajah Romaizah binti Haji Md Salleh, Minister of Education, Brunei Darussalam while the Government of the Republic of Singapore was represented by His Excellency Mr. Chan Chun Sing, Minister for Education, Republic of Singapore.
The Memorandum of Understanding the Brunei Darussalam - Singapore Youth Education Scholarship strengthen exchanges between youth and the future leaders of Brunei Darussalam and Singapore. This will help to improve the affinity and understanding between Brunei Darussalam and Singapore. The scholarship will be offered to select Bruneian students at pre-tertiary level, starting from secondary school.
The signing ceremony was held in conjunction with the state visit of His Majesty the Sultan and Yang Di-Pertuan of Brunei Darussalam to the Republic of Singapore from 24th to 25th August 2022. Also attending the signing ceremony was The Honourable Dato Seri Setia Dr Awang Haji Mohd Amin Liew Abdullah, Minister at the Prime Ministers Office and Minister of Finance and Economy II, Brunei Darussalam, Yang Mulia Dato Seri Paduka Awang Mohd Riza bin Dato Paduka Haji Mohd Yunos, Deputy Minister (Civil Service Governance), Prime Minister's Office, Brunei Darussalam, His Excellency Dato Paduka Hj Sidek bin Haji Ali, High Commissioner of Brunei Darussalam to Singapore, and Yang Mulia Dr. Haji Azman bin Ahmad, Permanent Secretary (Higher Education), Ministry of Education, Brunei Darussalam.
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PENANDATANGANAN MEMORANDUM PERSEFAHAMAN
BIASISWA PENDIDIKAN BELIA BRUNEI DARUSSALAM – SINGAPURA
Rabu, 24 Ogos 2022 – Kerajaan Kebawah Duli Yang Maha Mulia Paduka Seri Baginda Sultan dan Yang Di-Pertuan Negara Brunei Darussalam dan Kerajaan Republik Singapura, hari ini menandatangani Memorandum Persefahaman Biasiswa Pendidikan Belia Brunei Darussalam – Singapura.
Menandatangani bagi pihak Kerajaan Kebawah Duli Yang Maha Mulia Paduka Seri Baginda Sultan dan Yang Di-Pertuan Negara Brunei Darussalam ialah Yang Berhormat Datin Seri Setia Dr. Hajah Romaizah binti Haji Md Salleh, Menteri Pendidikan, Negara Brunei Darussalam manakala Kerajaan Republik Singapura diwakili oleh Tuan Yang Terutama Chan Chun Sing, Menteri Pendidikan, Republik Singapura.
Memorandum Persefahaman Biasiswa Pendidikan Belia Brunei Darussalam - Singapura ini dihasratkan untuk mengukuhkan pertukaran antara belia dan pemimpin masa depan Negara Brunei Darussalam dan Singapura. Kerjasama ini dihasratkan untuk dapat meningkatkan pertalian dan persefahaman antara Negara Brunei Darussalam dan Singapura. Adapun Biasiswa Pendidikan Belia Negara Brunei Darussalam-Singapura ini akan ditawarkan kepada pelajar-pelajar Negara Brunei Darussalam terpilih di peringkat pra-universiti, bermula dari sekolah menengah.
Majlis menandatangani perjanjian itu diadakan bersempena dengan Lawatan Negara Kebawah Duli Yang Maha Mulia Paduka Seri Baginda Sultan dan Yang Di-Pertuan Negara Brunei Darussalam ke Republik Singapura dari 24 hingga 25 Ogos 2022. Turut hadir semasa Majlis Penandatanganan tersebut ialah Yang Berhormat Dato Seri Setia Dr Awang Haji Mohd Amin Liew Abdullah, Menteri di Jabatan Perdana Menteri dan Menteri Kewangan dan Ekonomi II, Negara Brunei Darussalam, Yang Mulia Dato Seri Paduka Awang Mohd Riza bin Dato Paduka Haji Mohd Yunos, Timbalan Menteri (Urustadbir Perkhidmatan Awam), Jabatan Perdana Menteri, Negara Brunei Darussalam, Tuan Yang Terutama Dato Paduka Hj Sidek bin Haji Ali, Pesuruhjaya Tinggi Negara Brunei Darussalam ke Singapura, dan Yang Mulia Dr. Haji Azman bin Ahmad, Setiausaha Tetap (Pengajian Tinggi), Kementerian Pendidikan, Negara Brunei Darussalam.
Rujukan: KPE/CCD/K1:2/PR/71 (M)
Tarikh: 29 Muharram 1444H / 27 Ogos 2022M
